Bis(p-hydroxyphenyl)methane (CAS 620-92-8) — formula C13H12O2, molecular weight 200.23; category organic chemicals.
| CAS Number | 620-92-8 |
|---|---|
| Molecular Formula | C13H12O2 |
| Molecular Weight | 200.23 |
| Melting Point | 162.5 °C |
| LogP | log Kow = 2.91 |
| Applications | Uses: Bisphenol F is used to make epoxy resins and coatings for various applications, such as lacquers, varnishes, liners, adhesives, plastics, water pipes, dental sealants, and food packaging., Epoxy resins based on bisphenol F are used primarily as functional diluents in applications requiring a low viscosity, high performance resin system (e.g., solvent-free coatings). ... Bisphenol F epoxy resins are used in high solids, high build systems such as tank and pipe linings, industrial floors, road and bridge deck toppings, structural adhesives, grouts, coatings, and electrical varnishes., Methods of Manufacturing: The lowest MW member of the phenol novolacs is bisphenol F, which is prepared with a large excess of phenol to formaldehyde, a mixture of o, o', o, p', and p, p' isomers is obtained., U.S. Production: Non-confidential 2016 Chemical Data Reporting (CDR) information on the production and use of chemicals manufactured or imported into the United States. Chemical: 4, 4'-Dihydroxydiphenylmethane:, Table: National Aggregate Production Volume (pounds) [Table#8074], General Manufacturing Information: Phenol, 4, 4'-methylenebis-: ACTIVE, In 2005 the European Union banned the production of bisphenol F diglycidyl ether as a food packaging material., Bisphenol F diglycidyl ether |
| Category | Organic Chemicals |
Documented applications: Uses: Bisphenol F is used to make epoxy resins and coatings for various applications, such as lacquers, varnishes, liners, adhesives, plastics, water pipes, dental sealants, and food packaging., Epoxy resins based on bisphenol F are used primarily as functional diluents in applications requiring a low viscosity, high performance resin system (e.g., solvent-free coatings). ... Bisphenol F epoxy resins are used in high solids, high build systems such as tank and pipe linings, industrial floors, road and bridge deck toppings, structural adhesives, grouts, coatings, and electrical varnishes., Methods of Manufacturing: The lowest MW member of the phenol novolacs is bisphenol F, which is prepared with a large excess of phenol to formaldehyde, a mixture of o, o', o, p', and p, p' isomers is obtained., U.S. Production: Non-confidential 2016 Chemical Data Reporting (CDR) information on the production and use of chemicals manufactured or imported into the United States. Chemical: 4, 4'-Dihydroxydiphenylmethane:, Table: National Aggregate Production Volume (pounds) [Table#8074], General Manufacturing Information: Phenol, 4, 4'-methylenebis-: ACTIVE, In 2005 the European Union banned the production of bisphenol F diglycidyl ether as a food packaging material., Bisphenol F diglycidyl ether.
Bis(p-hydroxyphenyl)methane is a carbon-based organic compound with CAS registry number 620-92-8 and molecular formula C13H12O2 (molecular weight 200.23), belonging to the organic chemicals segment of chemical raw materials.
CAS number: 620-92-8
Its molecular formula C13H12O2 comprises 13 C, 12 H, 2 O atoms.
Also known as: Bis(p-hydroxyphenyl)methane · 双(对羟基苯基)甲烷
Category: organic chemicals
The CAS registry number of Bis(p-hydroxyphenyl)methane is 620-92-8.
Molecular formula C13H12O2, molecular weight 200.23.
It is also registered under: Bis(p-hydroxyphenyl)methane, 双(对羟基苯基)甲烷.
Recorded applications: Uses: Bisphenol F is used to make epoxy resins and coatings for various applications, such as lacquers, varnishes, liners, adhesives, plastics, water pipes, dental sealants, and food packaging., Epoxy resins based on bisphenol F are used primarily as functional diluents in applications requiring a low viscosity, high performance resin system (e.g., solvent-free coatings). ... Bisphenol F epoxy resins are used in high solids, high build systems such as tank and pipe linings, industrial floors, road and bridge deck toppings, structural adhesives, grouts, coatings, and electrical varnishes., Methods of Manufacturing: The lowest MW member of the phenol novolacs is bisphenol F, which is prepared with a large excess of phenol to formaldehyde, a mixture of o, o', o, p', and p, p' isomers is obtained., U.S. Production: Non-confidential 2016 Chemical Data Reporting (CDR) information on the production and use of chemicals manufactured or imported into the United States. Chemical: 4, 4'-Dihydroxydiphenylmethane:, Table: National Aggregate Production Volume (pounds) [Table#8074], General Manufacturing Information: Phenol, 4, 4'-methylenebis-: ACTIVE, In 2005 the European Union banned the production of bisphenol F diglycidyl ether as a food packaging material., Bisphenol F diglycidyl ether.
Category: Organic Chemicals.
Independent reference data for Bis(p-hydroxyphenyl)methane (CAS 620-92-8), compiled from public chemistry databases.
| CAS Registry Number | 620-92-8 |
|---|---|
| PubChem CID | 12111 |
| Molecular formula | C13H12O2 |
| IUPAC name | 4-[(4-hydroxyphenyl)methyl]phenol |
| UNII (FDA) | QD2C19044Z |
| Molecular Weight | 200.23 |
|---|---|
| XLogP3 | 2.9 |
| Hydrogen Bond Donor Count | 2 |
| Hydrogen Bond Acceptor Count | 2 |
| Rotatable Bond Count | 2 |
| Exact Mass | 200.083729621 |
| Monoisotopic Mass | 200.083729621 |
| Topological Polar Surface Area | 40.5 |
| Heavy Atom Count | 15 |
| Melting Point | 162.5 °C |
|---|---|
| LogP | log Kow = 2.91 |
| LogP | 2.91 |
| Dissociation Constants | pKa1 = 7.55, pKa2 = 10.80 at 25 °C |
| Collision Cross Section | 155.05 Ų [M-H]- |
4,4'-Methylenediphenol; 620-92-8; Bisphenol F; 4,4'-Dihydroxydiphenylmethane; Bis(4-hydroxyphenyl)methane; Phenol, 4,4'-methylenebis-; p-(p-Hydroxybenzyl)phenol; Phenol, 4,4'-methylenedi-; 4,4'-Methylenebisphenol; 4,4'-bisphenol F; BIS(P-HYDROXYPHENYL)METHANE; p,p'-Bis(hydroxyphenyl)methane; 4,4'-Methylene diphenol; 4,4'-Methylenebis(phenol); DTXSID9022445; p,p'-BPF
| GHS notification summary | 3.8% (5 / 130) |
|---|
| GHS notification summary | 3.8% (5 / 130) |
|---|---|
| Reported hazard statements | H315 (80.8%), H317 (12.3%), H318 (10.8%), H319 (80.8%), H335 (79.2%), H411 (11.5%), H412 (40%) |
This chemical does not meet GHS hazard criteria for 3.8% (5 of 130) of reports.
H315 (80.8%): Causes skin irritation [Warning Skin corrosion/irritation]
Bis(p-hydroxyphenyl)methane · CAS 620-92-8 · C13H12O2. UNII QD2C19044Z. Melting Point: 162.5 °C; LogP: log Kow = 2.91; LogP: 2.91.
Source: PubChem / Wikidata; the batch COA governs where values differ.
Supplier: Jinan Shenghe Chemical Co., Ltd.
中文页面: 双(对羟基苯基)甲烷