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双(对羟基苯基)甲烷

CAS 620-92-8C13H12O2MW 200.23

双(对羟基苯基)甲烷(CAS 620-92-8):分子式 C13H12O2、分子量 200.23。

产品概览

CAS号620-92-8
分子式C13H12O2
分子量200.23
熔点162.5 °C
LogPlog Kow = 2.91
应用领域Uses: Bisphenol F is used to make epoxy resins and coatings for various applications、such as lacquers、varnishes、liners、adhesives、plastics、water pipes、dental sealants、and food packaging.、Epoxy resins based on bisphenol F are used primarily as functional diluents in applications requiring a low viscosity、high performance resin system (e.g.、solvent-free coatings). ... Bisphenol F epoxy resins are used in high solids、high build systems such as tank and pipe linings、industrial floors、road and bridge deck toppings、structural adhesives、grouts、coatings、and electrical varnishes.、Methods of Manufacturing: The lowest MW member of the phenol novolacs is bisphenol F、which is prepared with a large excess of phenol to formaldehyde、a mixture of o、o'、o、p'、and p、p' isomers is obtained.、U.S. Production: Non-confidential 2016 Chemical Data Reporting (CDR) information on the production and use of chemicals manufactured or imported into the United States. Chemical: 4、4'-Dihydroxydiphenylmethane:、Table: National Aggregate Production Volume (pounds) [Table#8074]、General Manufacturing Information: Phenol、4、4'-methylenebis-: ACTIVE、In 2005 the European Union banned the production of bisphenol F diglycidyl ether as a food packaging material.、Bisphenol F diglycidyl ether

应用领域

登记用途:Uses: Bisphenol F is used to make epoxy resins and coatings for various applications、such as lacquers、varnishes、liners、adhesives、plastics、water pipes、dental sealants、and food packaging.、Epoxy resins based on bisphenol F are used primarily as functional diluents in applications requiring a low viscosity、high performance resin system (e.g.、solvent-free coatings). ... Bisphenol F epoxy resins are used in high solids、high build systems such as tank and pipe linings、industrial floors、road and bridge deck toppings、structural adhesives、grouts、coatings、and electrical varnishes.、Methods of Manufacturing: The lowest MW member of the phenol novolacs is bisphenol F、which is prepared with a large excess of phenol to formaldehyde、a mixture of o、o'、o、p'、and p、p' isomers is obtained.、U.S. Production: Non-confidential 2016 Chemical Data Reporting (CDR) information on the production and use of chemicals manufactured or imported into the United States. Chemical: 4、4'-Dihydroxydiphenylmethane:、Table: National Aggregate Production Volume (pounds) [Table#8074]、General Manufacturing Information: Phenol、4、4'-methylenebis-: ACTIVE、In 2005 the European Union banned the production of bisphenol F diglycidyl ether as a food packaging material.、Bisphenol F diglycidyl ether。

技术档案

这个产品是什么

双(对羟基苯基)甲烷 是一种化工化合物,登记 CAS 号为 620-92-8,分子式 C13H12O2(分子量 200.23)。

识别信息

登记 CAS 号:620-92-8

其分子式 C13H12O2 由 13 个碳、12 个氢、2 个氧 组成。

别名/同义词:双(对羟基苯基)甲烷 · Bis(p-hydroxyphenyl)methane

常见问题

双(对羟基苯基)甲烷 的 CAS 号是多少?

双(对羟基苯基)甲烷 的 CAS 登记号为 620-92-8。

双(对羟基苯基)甲烷 的分子式与分子量是多少?

分子式 C13H12O2,分子量 200.23。

双(对羟基苯基)甲烷 还有哪些别名?

别名/同义词:双(对羟基苯基)甲烷、Bis(p-hydroxyphenyl)methane。

双(对羟基苯基)甲烷 的登记用途是什么?

登记用途:Uses: Bisphenol F is used to make epoxy resins and coatings for various applications、such as lacquers、varnishes、liners、adhesives、plastics、water pipes、dental sealants、and food packaging.、Epoxy resins based on bisphenol F are used primarily as functional diluents in applications requiring a low viscosity、high performance resin system (e.g.、solvent-free coatings). ... Bisphenol F epoxy resins are used in high solids、high build systems such as tank and pipe linings、industrial floors、road and bridge deck toppings、structural adhesives、grouts、coatings、and electrical varnishes.、Methods of Manufacturing: The lowest MW member of the phenol novolacs is bisphenol F、which is prepared with a large excess of phenol to formaldehyde、a mixture of o、o'、o、p'、and p、p' isomers is obtained.、U.S. Production: Non-confidential 2016 Chemical Data Reporting (CDR) information on the production and use of chemicals manufactured or imported into the United States. Chemical: 4、4'-Dihydroxydiphenylmethane:、Table: National Aggregate Production Volume (pounds) [Table#8074]、General Manufacturing Information: Phenol、4、4'-methylenebis-: ACTIVE、In 2005 the European Union banned the production of bisphenol F diglycidyl ether as a food packaging material.、Bisphenol F diglycidyl ether。

PubChem 公开数据

双(对羟基苯基)甲烷(CAS 620-92-8)的独立参考数据,整理自公开化学数据库。

各数据库的登记标识

CAS Registry Number620-92-8
PubChem CID12111
Molecular formulaC13H12O2
IUPAC name4-[(4-hydroxyphenyl)methyl]phenol
UNII (FDA)QD2C19044Z

计算分子描述符

Molecular Weight200.23
XLogP32.9
Hydrogen Bond Donor Count2
Hydrogen Bond Acceptor Count2
Rotatable Bond Count2
Exact Mass200.083729621
Monoisotopic Mass200.083729621
Topological Polar Surface Area40.5
Heavy Atom Count15

在册的理化数值

Melting Point162.5 °C
LogPlog Kow = 2.91
LogP2.91
Dissociation ConstantspKa1 = 7.55, pKa2 = 10.80 at 25 °C
Collision Cross Section155.05 Ų [M-H]-

在册的记载用途

    Bisphenol F is used to make epoxy resins and coatings for various applications, such as lacquers, varnishes, liners, adhesives, plastics, water pipes, dental sealants, and food packaging.Epoxy resins based on bisphenol F are used primarily as functional diluents in applications requiring a low viscosity, high performance resin system (e.g., solvent-free coatings). ... Bisphenol F epoxy resins are used in high solids, high build systems such as tank and pipe linings, industrial floors, road and bridge deck toppings, structural adhesives, grouts, coatings, and electrical varnishes.

    同义词与商品名

    4,4'-Methylenediphenol; 620-92-8; Bisphenol F; 4,4'-Dihydroxydiphenylmethane; Bis(4-hydroxyphenyl)methane; Phenol, 4,4'-methylenebis-; p-(p-Hydroxybenzyl)phenol; Phenol, 4,4'-methylenedi-; 4,4'-Methylenebisphenol; 4,4'-bisphenol F; BIS(P-HYDROXYPHENYL)METHANE; p,p'-Bis(hydroxyphenyl)methane; 4,4'-Methylene diphenol; 4,4'-Methylenebis(phenol); DTXSID9022445; p,p'-BPF

    已收录的法规名录

    GHS notification summary3.8% (5 / 130)

    GHS 危害分类

    GHS notification summary3.8% (5 / 130)
    Reported hazard statementsH315 (80.8%), H317 (12.3%), H318 (10.8%), H319 (80.8%), H335 (79.2%), H411 (11.5%), H412 (40%)

    This chemical does not meet GHS hazard criteria for 3.8% (5 of 130) of reports.

    H315 (80.8%): Causes skin irritation [Warning Skin corrosion/irritation]

    公开数据库对它的描述

    Bis(p-hydroxyphenyl)methane · CAS 620-92-8 · C13H12O2. UNII QD2C19044Z. Melting Point: 162.5 °C; LogP: log Kow = 2.91; LogP: 2.91.

    物理形态与操作说明

    数据来源:PubChem / Wikidata;与随货 COA 不一致时以 COA 为准。

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