双(三甲基甲硅烷基)氨基锂（CAS 4039-32-1）：分子式 C6H19NSi2、分子量 161.39。
| CAS号 | 4039-32-1 |
|---|---|
| 分子式 | C6H19NSi2 |
| 分子量 | 161.39 |
| 沸点 | 125 °C |
| 应用领域 | Uses: Used to deactivate chromatography support materials and to promote adhesion of photoresists in the electronics industry、[HSDB]、Semiconductor Manufacturing [Category: Industry]、Deactivation of chromatographic support materials. In electronic industry as an adhesion promoter for photoresists on silicon.、The substance is used as a chemical intermediate in the production of siloxane polymers.、Industry Uses: Waterproofing agent、Viscosity modifiers、Surface modifier、Intermediate、Adhesion、cohesion promoter、Binder、Polymerization promoter、Solvent、Semiconductor and photovoltaic agent、Processing aids not otherwise specified、Consumer Uses: Solvent、Waterproofing agent、Household Products: Information on 20 consumer products that contain Hexamethyldisilazane in the following categories is provided:、• Home Maintenance、• Landscaping、Yard、Formulations、Preparations: 1、1、3、3-Hexamethyldisilazane is available in concentrations ranging in activity from 5 to 100%. In solutions、HMDS is normally mixed with solvents such as xylene、stoddard solvent、ethylene glycol and carbon tetrafluoride.、Consumption Patterns: (1980) About 303X10+3 L of 100% active HMDS was consumed by the semiconductor industry in the United States.、U.S. Production: 2023: 4、000、000 - <5、500、000 lb、2022: 5、000 - <7、2021: 5、2020: 5、General Manufacturing Information: Plastics Material and Resin Manufacturing、Paint and Coating Manufacturing、Non-metallic Mineral Product Manufacturing (includes clay、glass、cement、concrete、lime、gypsum、and other non-metallic mineral product manufacturing)、All Other Chemical Product and Preparation Manufacturing、Miscellaneous Manufacturing、Other (requires additional information)、All Other Basic Organic Chemical Manufacturing、Rubber Product Manufacturing、Pharmaceutical and Medicine Manufacturing、All Other Basic Inorganic Chemical Manufacturing、Synthetic Rubber Manufacturing、Computer and Electronic Product Manufacturing、Silanamine、1-trimethyl-N-(trimethylsilyl)-: ACTIVE、All HMDS is sold as electronic-grade material、indicating that the level of each metal impurity is less than 1 ppm. |
登记用途：Uses: Used to deactivate chromatography support materials and to promote adhesion of photoresists in the electronics industry、[HSDB]、Semiconductor Manufacturing [Category: Industry]、Deactivation of chromatographic support materials. In electronic industry as an adhesion promoter for photoresists on silicon.、The substance is used as a chemical intermediate in the production of siloxane polymers.、Industry Uses: Waterproofing agent、Viscosity modifiers、Surface modifier、Intermediate、Adhesion、cohesion promoter、Binder、Polymerization promoter、Solvent、Semiconductor and photovoltaic agent、Processing aids not otherwise specified、Consumer Uses: Solvent、Waterproofing agent、Household Products: Information on 20 consumer products that contain Hexamethyldisilazane in the following categories is provided:、• Home Maintenance、• Landscaping、Yard、Formulations、Preparations: 1、1、3、3-Hexamethyldisilazane is available in concentrations ranging in activity from 5 to 100%. In solutions、HMDS is normally mixed with solvents such as xylene、stoddard solvent、ethylene glycol and carbon tetrafluoride.、Consumption Patterns: (1980) About 303X10+3 L of 100% active HMDS was consumed by the semiconductor industry in the United States.、U.S. Production: 2023: 4、000、000 - <5、500、000 lb、2022: 5、000 - <7、2021: 5、2020: 5、General Manufacturing Information: Plastics Material and Resin Manufacturing、Paint and Coating Manufacturing、Non-metallic Mineral Product Manufacturing (includes clay、glass、cement、concrete、lime、gypsum、and other non-metallic mineral product manufacturing)、All Other Chemical Product and Preparation Manufacturing、Miscellaneous Manufacturing、Other (requires additional information)、All Other Basic Organic Chemical Manufacturing、Rubber Product Manufacturing、Pharmaceutical and Medicine Manufacturing、All Other Basic Inorganic Chemical Manufacturing、Synthetic Rubber Manufacturing、Computer and Electronic Product Manufacturing、Silanamine、1-trimethyl-N-(trimethylsilyl)-: ACTIVE、All HMDS is sold as electronic-grade material、indicating that the level of each metal impurity is less than 1 ppm.。
双(三甲基甲硅烷基)氨基锂 是一种化工化合物，登记 CAS 号为 4039-32-1，分子式 C6H19NSi2（分子量 161.39）。
登记 CAS 号：4039-32-1
其分子式 C6H19NSi2 由 6 个碳、19 个氢、1 个氮、2 个硅 组成。
别名/同义词：双(三甲基甲硅烷基)氨基锂 · Lithium bis(trimethylsilyl)amide
双(三甲基甲硅烷基)氨基锂 的 CAS 登记号为 4039-32-1。
分子式 C6H19NSi2，分子量 161.39。
别名/同义词：双(三甲基甲硅烷基)氨基锂、Lithium bis(trimethylsilyl)amide。
登记用途：Uses: Used to deactivate chromatography support materials and to promote adhesion of photoresists in the electronics industry、[HSDB]、Semiconductor Manufacturing [Category: Industry]、Deactivation of chromatographic support materials. In electronic industry as an adhesion promoter for photoresists on silicon.、The substance is used as a chemical intermediate in the production of siloxane polymers.、Industry Uses: Waterproofing agent、Viscosity modifiers、Surface modifier、Intermediate、Adhesion、cohesion promoter、Binder、Polymerization promoter、Solvent、Semiconductor and photovoltaic agent、Processing aids not otherwise specified、Consumer Uses: Solvent、Waterproofing agent、Household Products: Information on 20 consumer products that contain Hexamethyldisilazane in the following categories is provided:、• Home Maintenance、• Landscaping、Yard、Formulations、Preparations: 1、1、3、3-Hexamethyldisilazane is available in concentrations ranging in activity from 5 to 100%. In solutions、HMDS is normally mixed with solvents such as xylene、stoddard solvent、ethylene glycol and carbon tetrafluoride.、Consumption Patterns: (1980) About 303X10+3 L of 100% active HMDS was consumed by the semiconductor industry in the United States.、U.S. Production: 2023: 4、000、000 - <5、500、000 lb、2022: 5、000 - <7、2021: 5、2020: 5、General Manufacturing Information: Plastics Material and Resin Manufacturing、Paint and Coating Manufacturing、Non-metallic Mineral Product Manufacturing (includes clay、glass、cement、concrete、lime、gypsum、and other non-metallic mineral product manufacturing)、All Other Chemical Product and Preparation Manufacturing、Miscellaneous Manufacturing、Other (requires additional information)、All Other Basic Organic Chemical Manufacturing、Rubber Product Manufacturing、Pharmaceutical and Medicine Manufacturing、All Other Basic Inorganic Chemical Manufacturing、Synthetic Rubber Manufacturing、Computer and Electronic Product Manufacturing、Silanamine、1-trimethyl-N-(trimethylsilyl)-: ACTIVE、All HMDS is sold as electronic-grade material、indicating that the level of each metal impurity is less than 1 ppm.。
双(三甲基甲硅烷基)氨基锂（CAS 4039-32-1）的独立参考数据，整理自公开化学数据库。
| CAS Registry Number | 4039-32-1 |
|---|---|
| PubChem CID | 13838 |
| Molecular formula | C6H19NSi2 |
| IUPAC name | [dimethyl-(trimethylsilylamino)silyl]methane |
| UNII (FDA) | H36C68P1BH |
| Molecular Weight | 161.39 |
|---|---|
| Hydrogen Bond Donor Count | 1 |
| Hydrogen Bond Acceptor Count | 1 |
| Rotatable Bond Count | 2 |
| Exact Mass | 161.10560268 |
| Monoisotopic Mass | 161.10560268 |
| Topological Polar Surface Area | 12 |
| Heavy Atom Count | 9 |
| Boiling Point | 125 °C |
|---|---|
| Boiling Point | 125 °C @760 [mm Hg] |
| Flash Point | 48 °F (NFPA, 2010) |
| Flash Point | 27 °C |
| Flash Point | 81 °F (27 °C) closed cup |
| Density | 0.7741 g/cu cm at 25 °C |
| Density | 0.76 @25 °C |
| Vapor Pressure | 13.8 [mmHg] |
| Vapor Pressure | 13.8 mm Hg at 25 °C |
| Vapor Pressure | 13.8 [mm Hg] @25 °C |
Hexamethyldisilazane; 999-97-3; HMDS; Bis(trimethylsilyl)amine; 1,1,1,3,3,3-Hexamethyldisilazane; Hexamethylsilazane; 1,1,1-Trimethyl-N-(trimethylsilyl)silanamine; Silanamine, 1,1,1-trimethyl-N-(trimethylsilyl)-; TSL 8802; hexamethyl disilazane; Disilazane, 1,1,1,3,3,3-hexamethyl-; SZ 6079; DTXSID2025395; H36C68P1BH; NSC-93895; DTXCID805395
| Regulatory & Food Contact | FDA Cumulative Estimated Daily Intake (CEDI): FCS |
|---|---|
| GHS notification summary | 5.8% (35 / 606) |
| GHS notification summary | 5.8% (35 / 606) |
|---|---|
| Reported hazard statements | H225 (93.7%), H302, H332 (27.1%), H311 (88.6%), H314 (31.8%), H412 (85.5%), H320, H331 |
This chemical does not meet GHS hazard criteria for 5.8% (35 of 606) of reports.
H225 (93.7%): Highly Flammable liquid and vapor [Danger Flammable liquids]
Lithium bis(trimethylsilyl)amide · CAS 4039-32-1 · C6H19NSi2. UNII H36C68P1BH. Boiling Point: 125 °C; Boiling Point: 125 °C @760 [mm Hg]; Flash Point: 48 °F (NFPA, 2010).
数据来源：PubChem / Wikidata；与随货 COA 不一致时以 COA 为准。
English page: Lithium bis(trimethylsilyl)amide