Bis(p-hydroxyphenyl)methane (CAS 620-92-8) — formula C13H12O2, molecular weight 200.23; category organic chemicals.
Bis(p-hydroxyphenyl)methane (CAS 620-92-8) is a chemical raw material in the organic chemicals category. Its molecular formula C13H12O2 comprises 13 C, 12 H, 2 O atoms. Its molecular weight is about 200.23. Reported physicochemical data: melting point around 162.5 °C, LogP about log Kow = 2.91. As a sourcing and distribution partner we help locate and compare this item across domestic and cross-border channels, arranging samples and batch orders with full COA and compliance files.
| CAS Number | 620-92-8 |
|---|---|
| Molecular Formula | C13H12O2 |
| Molecular Weight | 200.23 |
| Melting Point | 162.5 °C |
| LogP | log Kow = 2.91 |
| Applications | Bisphenol F is used to make epoxy resins and coatings for various applications, such as lacquers, varnishes, liners, adhesives, plastics |
| Category | Organic Chemicals |
Documented applications: Bisphenol F is used to make epoxy resins and coatings for various applications, such as lacquers, varnishes, liners, adhesives, plastics.
Bis(p-hydroxyphenyl)methane is a carbon-based organic compound with CAS registry number 620-92-8 and molecular formula C13H12O2 (molecular weight 200.23), belonging to the organic chemicals segment of chemical raw materials.
CAS number: 620-92-8
Its molecular formula C13H12O2 comprises 13 C, 12 H, 2 O atoms.
Also known as: Bis(p-hydroxyphenyl)methane · 双(对羟基苯基)甲烷
Category: organic chemicals
The CAS registry number of Bis(p-hydroxyphenyl)methane is 620-92-8.
Molecular formula C13H12O2, molecular weight 200.23.
It is also registered under: Bis(p-hydroxyphenyl)methane, 双(对羟基苯基)甲烷.
Recorded applications: Bisphenol F is used to make epoxy resins and coatings for various applications, such as lacquers, varnishes, liners, adhesives, plastics.
Category: Organic Chemicals.
Packaging is agreed per order, from lab-scale packs to bulk, and confirmed with each order rather than fixed on the page. A Certificate of Analysis (COA) ships with every batch and MSDS is available; where the end use carries a regulatory limit (food contact, pharmaceutical or cosmetic), state the standard at enquiry and the grade is set against it.
Independent reference data for Bis(p-hydroxyphenyl)methane (CAS 620-92-8), compiled from public chemistry databases.
| CAS Registry Number | 620-92-8 |
|---|---|
| PubChem CID | 12111 |
| Molecular formula | C13H12O2 |
| IUPAC name | 4-[(4-hydroxyphenyl)methyl]phenol |
| UNII (FDA) | QD2C19044Z |
| Molecular Weight | 200.23 |
|---|---|
| XLogP3 | 2.9 |
| Hydrogen Bond Donor Count | 2 |
| Hydrogen Bond Acceptor Count | 2 |
| Rotatable Bond Count | 2 |
| Exact Mass | 200.083729621 |
| Monoisotopic Mass | 200.083729621 |
| Topological Polar Surface Area | 40.5 |
| Heavy Atom Count | 15 |
| Melting Point | 162.5 °C |
|---|---|
| LogP | log Kow = 2.91 |
| LogP | 2.91 |
| Dissociation Constants | pKa1 = 7.55, pKa2 = 10.80 at 25 °C |
| Collision Cross Section | 155.05 Ų [M-H]- |
4,4'-Methylenediphenol; 620-92-8; Bisphenol F; 4,4'-Dihydroxydiphenylmethane; Bis(4-hydroxyphenyl)methane; Phenol, 4,4'-methylenebis-; p-(p-Hydroxybenzyl)phenol; Phenol, 4,4'-methylenedi-; 4,4'-Methylenebisphenol; 4,4'-bisphenol F; BIS(P-HYDROXYPHENYL)METHANE; p,p'-Bis(hydroxyphenyl)methane; 4,4'-Methylene diphenol; 4,4'-Methylenebis(phenol); DTXSID9022445; p,p'-BPF
| GHS notification summary | 3.8% (5 / 130) |
|---|
| GHS notification summary | 3.8% (5 / 130) |
|---|---|
| Reported hazard statements | H315 (80.8%), H317 (12.3%), H318 (10.8%), H319 (80.8%), H335 (79.2%), H411 (11.5%), H412 (40%) |
This chemical does not meet GHS hazard criteria for 3.8% (5 of 130) of reports.
H315 (80.8%): Causes skin irritation [Warning Skin corrosion/irritation]
Bis(p-hydroxyphenyl)methane · CAS 620-92-8 · C13H12O2. UNII QD2C19044Z. Melting Point: 162.5 °C; LogP: log Kow = 2.91; LogP: 2.91.
Source: PubChem / Wikidata; the batch COA governs where values differ.
Supplier: Jinan Shenghe Chemical Co., Ltd.
中文页面: 双(对羟基苯基)甲烷